Advanced materials and technologies for improving the electromagnetic shielding of electronic devices against unwanted emissions
DOI:
https://doi.org/10.34169/2414-0651.2025.4(48).60-68Keywords:
countering technical intelligence, technical information security, unintended electromagnetic emissions and interferences, electromagnetic wave absorption, shielding, TEMPEST standards, composite materials, conductive polymers, polymer composite structuresAbstract
The article examines modern approaches to shielding unintended electromagnetic emissions and interferences (EMI) of computer equipment, taking into account the requirements of TEMPEST information security. The relevance of the problem of confidential information leakage through EMI of portable devices and the limitations of traditional shielding materials, such as certain metals, are highlighted. An analysis of recent scientific research concerning the development of advanced shielding solutions is provided, including materials based on graphene, conductive polymer mixtures, laminated carbon fiber tape and magnesium alloys.
Special attention is given to the TEMPEST concept and its security levels according to NATO and U.S. standards, which emphasize the need for a comprehensive approach to minimizing all potential information leakage channels. Traditional metallic shielding materials (copper, aluminum, steel) are considered, with their advantages and disadvantages noted. Information is presented on new composite materials based on polymers with various conductive fillers (carbon fillers, metallic fillers, inorganic nanomaterials such as MXene, magnetic particles), as well as on the use of structural features of materials (foams, aerogels, multilayer, gradient, core–shell and segregated structures) that ensure increased efficiency of electromagnetic energy absorption.
Modern shielding technologies are analyzed, including coating inner surfaces with metallic paints, using gaskets and shielding tapes to seal seams and connectors. Trends in the development of shielding technologies are outlined, which include the creation of lightweight, flexible, ultrathin and multifunctional materials.
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Copyright (c) 2025 Олександр Ковбасюк,Олександр Башкиров,Олександр Ковалько,Сергій Ступак
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